Methods for Improving Heat Dissipation and Thermal Management in Modern Electronic Devices: A comprehensive Study
DOI:
https://doi.org/10.36676/dira.v12.i3.59Keywords:
Modern electronic, heat dissipation, thermal managementAbstract
Modern electronic devices are becoming increasingly powerful and compact, leading to significant challenges in heat dissipation and thermal management. Efficient thermal management is crucial to ensure the reliability, performance, and longevity of these devices. This research paper explores various methods and technologies for improving heat dissipation and thermal management in electronic devices, including advanced materials, innovative cooling techniques, and thermal design strategies. By analyzing current trends and future directions, this study aims to provide a comprehensive understanding of effective thermal management solutions.
References
Books
Kraus, A. D., Bar-Cohen, A., & Kraus, A. (1996). Thermal Analysis and Control of Electronic Equipment. Wiley-Interscience.
Tummala, R. R., & Rymaszewski, E. J. (1989). Microelectronics Packaging Handbook. Springer.
Lasance, C. J. M., & Poppe, A. (2014). Thermal Management for LED Applications. Springer.
Journal Articles
Elgamal, R., Mohamed, E. A., Abd El-Raouf, H., & Khattab, M. M. (2020). "Nanofluids and their applications in electronic cooling: A review." Journal of Molecular Liquids, 318, 113998. doi:10.1016/j.molliq.2020.113998
Singh, R., & Kumar, P. (2021). "A comprehensive review on current thermal management and heat dissipation methods for electronics." Applied Thermal Engineering, 184, 116231. doi:10.1016/j.applthermaleng.2020.116231
Choi, S. U. S., & Eastman, J. A. (1995). "Enhancing thermal conductivity of fluids with nanoparticles." ASME International Mechanical Engineering Congress & Exposition, San Francisco, CA. doi:10.2172/106202
Conference Papers
Balandin, A. A. (2011). "Thermal properties of graphene and nanostructured carbon materials." Nature Materials, 10(8), 569-581. doi:10.1038/nmat3064
Garimella, S. V., & Fleischer, A. S. (2009). "Thermal challenges in next-generation electronic systems." 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 243-251. doi:10.1109/STHERM.2009.4831057
Eiland, R., Kesler, M., North, M. T., & Ellzey, J. L. (2013). "An investigation of microchannel heat exchangers for high heat flux applications." International Journal of Heat and Mass Transfer, 66, 595-605. doi:10.1016/j.ijheatmasstransfer.2013.07.060
Review Articles and Reports
Tuckerman, D. B., & Pease, R. F. W. (1981). "High-performance heat sinking for VLSI." IEEE Electron Device Letters, 2(5), 126-129. doi:10.1109/EDL.1981.25367
Ziabari, A. A., Shams, M., & Shafai, B. (2019). "A review of cooling techniques for thermal management of electronics." IEEE Access, 7, 159796-159820. doi:10.1109/ACCESS.2019.2951224
Ellsworth, M. J., Iyengar, M. K., & Schmidt, R. R. (2015). "Liquid cooling for electronic equipment: From chip to system." Journal of Electronic Packaging, 137(4). doi:10.1115/1.4030592
J. R. Culham, M. M. Yovanovich, and V. Addepalli, "Thermal Management of Microelectronic Devices: A Review of Current Solutions and Future Directions," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 4, no. 11, pp. 1786-1798, 2014.
D. G. Cahill, P. V. Braun, G. Chen, et al., "Nanoscale thermal transport. II. 2003–2012," Applied Physics Reviews, vol. 1, no. 1, p. 011305, 2014.
A. Bar-Cohen, "Gen-3 Thermal Management Technology: Role of Microchannels and Nanostructures in an Embedded Cooling Paradigm," IEEE Transactions on Components and Packaging Technologies, vol. 31, no. 1, pp. 2-9, 2008.
A. F. Mills and V. G. Prabhu, "Heat Transfer in Electronics," in Heat Transfer, Upper Saddle River, NJ: Prentice Hall, 1999, pp. 627-661.
T. Brunschwiler, B. Smith, and E. Schmid, "A Review of Current and Future Thermal Management Technologies for Microprocessors," Journal of Electronic Packaging, vol. 136, no. 2, p. 020907, 2014.
Theses and Dissertations
Sharma, S. (2018). "Development and Characterization of High Thermal Conductivity Nanocomposite Materials for Electronic Packaging." Ph.D. Dissertation, Georgia Institute of Technology.
Patents
Lasance, C. J. M., & Simons, R. E. (2015). "Thermal management of electronics." U.S. Patent No. 8,962,958.
Online Resources and Industry Reports
IEEE Xplore Digital Library. (2023). "Advanced Thermal Management Techniques." Available at: https://ieeexplore.ieee.org
Frost & Sullivan. (2020). "Innovations in Thermal Management for Electronics." Available at: https://www.frost.com
Additional References
Salamon, T. R., & Tiwari, A. (2016). "Thermal management in emerging technologies: Advances and applications." Nano Energy, 19, 53-62. doi:10.1016/j.nanoen.2015.11.024
Razeghi, M., & Balandin, A. (2018). "Thermal and Thermoelectric Transport in Semiconductor Nanostructures." Annual Review of Heat Transfer, 21, 25-50. doi:10.1615/AnnualRevHeatTransfer.2018011344
Downloads
Published
How to Cite
License
Copyright (c) 2024 Vardaan Malik
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.
